• 疏水性细菌粘附宿表面能力的一个重要组织部分

    Hydrophobicity is one of adherent forces by which bacteria adhere to host surface.

    youdao

  • 实施方式中晶体管包括具有主表半导体传导结构

    In an embodiment, the transistor can include a semiconductor layer having a primary surface and a conductive structure.

    youdao

  • 植食性昆虫的寄标记信息素只主表面用触角产卵检测

    Insects use chemoreceptors on ovipositors, mouthparts, antennae or tarsi to detect marking pheromones.

    youdao

  • 以及用树脂密封被减述半导体芯片表面述第二表面

    Side surfaces and the second main surface of the semiconductor chip made thin are sealed with resin.

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  • 炭化处理纤维相比石墨纤维晶体结构更加完整,沿纤维主表取向程度更高。

    In comparison with the carbonized fibers, the carbon fibers after graphitization treatment display more perfect crystal orientation along the main surface of ribbon-shaped carbon fibers.

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  • 采用发明消毒方法,既充分消灭宿表面的杂又能最大限度 减少宿内生损伤

    The said method can kill microbes on the surface of host completely while reducing the damage to endophyte in the host at most.

    youdao

  • 包含一个拱廊,它是通过建筑主表面的边缘线条向里收缩形成,它将街道建筑融为一体

    The ground floor consists of an arcade, obtained by pulling back the building's perimeter wire of the main facade, thus allowing the integration between the street level and the new building.

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  • 通过研磨所述半导体芯片所述第一表面相对第二主表面使所述半导体芯片减薄,所述半导体芯片与所述板相连接

    The semiconductor chip is made thin by grinding a second main surface opposing to the first main surface of the semiconductor chip which is connected with the substrate.

    youdao

  • 通过研磨所述半导体芯片所述第一表面相对第二主表面使所述半导体芯片减薄,所述半导体芯片与所述板相连接

    The semiconductor chip is made thin by grinding a second main surface opposing to the first main surface of the semiconductor chip which is connected with the substrate.

    youdao

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