自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。
The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
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