这种新型的硅基发光管结构在下一代集成电路中作为芯片之间或芯片内部的光互连具有非常广阔的应用前景。
The new type silicon-based luminous tube structure has a widely application prospect as light connection between chips or chips inner in next generation integrated circuit.
下一代的大规模集成电路的测试探头要求使用在铝电极上的低接触力的联接方法。
The contact method with low contact force on Al electrodes is required for test probing of LSI for the next generation.
下一代的大规模集成电路的测试探头要求使用在铝电极上的低接触力的联接方法。
The contact method with low contact force on Al electrodes is required for test probing of LSI for the next generation.
应用推荐