在冲向这堵墙的过程中，为了保持速度，通过把集成电路堆叠起来增加密度，闪存业已开始制造三维芯片。
To keep up speed on the way to the wall, the industry has begun building three-dimensionalchips by stacking circuits on topof one another to increase densities.
垂直互连是三维微波和毫米波集成电路中的典型结构。
Vertical interconnections are typical structures in three dimensional microwave and millimeter wave integrated circuits.
第三章详细介绍了采用超声波方法进行三维人体坐标测量的硬件电路设计。
Third chapter introduced in detail about USES the ultrasonic wave method to carry on the three dimensional human body coordinates survey the hardware circuit design.
当这进行到终点时，我们将进入第六种模式，即三维自组织分子电路。
When that comes to an end we'll go to the sixth paradigm, three-dimensional self-organizing molecular circuits.
利用三维空间矢量，提出了一种新型的无需坐标变换的三相电路畸变电流检测方法。
Using three-dimensional space vectors, this paper describes a simple method for detecting the distorted current without any coordinate transformation.
本文介绍了一种大幅面三维激光雕刻机的原理和构成，并详细讨论了数据文件的格式、系统的硬件电路和软件设计。
The principle and structure of a large size three-dimensional laser-engraving machine has been introduced in this paper, discussed the format of data file, the design of hardware and software.
进阶三维电脑的电路设计。
然后通过三维电磁场仿真，并结合微波电路理论对封装结构，特别是高频信号传输路径进行了优化设计，另外对盖板的效应进行了定性分析。
Then, package structure, especially the signal transmitting path structure is optimized using 3d electromagnetic simulation and microwave circuit theory. Effect of package lid is also studied.
本文介绍了用于激光三维图像数据采集系统中的硬件数据补偿电路和实现高速串行通讯的RS- 422接口电路。
In this paper we mainly discuss the data compensating principle and its circuit accomplishment, RS-422 interface adaptor which are used in a high-speed data acquisition system.
三维微电子学主要研究三维集成电路的设计与制造。
Three-dimensional microelectronics focuses on the design and fabrication technology for 3-d integrated circuits.
目前流行的多层微波电路技术，正是三维空间电路技术重要应用之一。
The current popular multi-layer microwave circuit is one of the most important applications in the three-dimensional space technology.
建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.
建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.
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