利用商用三维电磁场分析软件HFSS对集成化低噪声放大器组装和互连中的关键参数进行了仿真和优化。
Some critical parameters of packaging and interconnection of the integrated LNA were simulated and optimized by using commercial 3d electromagnetic field analysis software HFSS.
为了使系统获得更高的图像分辨率，通过电磁场有限元仿真软件COMSOL分析，构建ERT/ECT双模态敏感阵列电极三维模型。
In order to improve the image resolution of the system, a 3D model of ERT/ ECT dual-modality sensing electrode array was established by using the software COMSOL.
为了使系统获得更高的图像分辨率，通过电磁场有限元仿真软件COMSOL分析，构建ERT/ECT双模态敏感阵列电极三维模型。
In order to improve the image resolution of the system, a 3D model of ERT/ ECT dual-modality sensing electrode array was established by using the software COMSOL.
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