其中，位于基板上的主动元件具有一绝缘层。
Among them, the active component on the substrate has an insulating layer.
此外，形成一绝缘层，以覆盖电子发射源及阳极处理层。
In addition, an insulation layer is formed for covering the electronic emission sources and the anodic treatment layer.
第一绝缘层位于衬底上，以及第二绝缘层位于第一绝缘层上。
A first insulating layer is on the substrate, and a second insulating layer is on the first insulating layer.
具有在其顶表面上的掩模的半导体材料的鳍部形成在第一绝缘层上。
A fin of a semiconductor material having a mask on a top surface of the fin is formed on a first insulating layer.
在第 一绝缘层上或在第一绝缘层上方形成像素电极，以及在第二或第三绝 缘层上形成公共电极。
The pixel electrodes are formed on or over the first insulating layer and the common electrode is formed on the second or third insulating layer.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
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