• At Carnegie Mellon, the President will tour various next-generation technology projects that accelerate the manufacturing process and support the creation of good jobs.

    WHITEHOUSE: The White House Blog: The President

  • Implemented in a 28nm manufacturing process, the chipsets will feature significant improvements in performance and power consumption from previous generations and provide support for multiple mobile broadband technologies to deliver a best-in-class mobile broadband experience for smartphones, tablets, ultra-portable notebooks, portable hotspots, dongles and CPEs (Customer Premises Equipment).

    ENGADGET: Qualcomm's Gobi modem chipsets combine 84Mbps HSPA+, LTE-Advanced

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