Zeiss is running out of space for its chip-technology business, and is building a new DM200m factory at Oberkochen.
If built cleverly, they permit the chip designer to pack more computing power into a small space without causing the chip to misfire.
The new trick also gives chip designers more surface space to work with, allowing them to pack more transistors together.
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In the meantime the hosts survived exciting full-back Barry Davies' chip and chase into space and led 10-0 at the break.
The scrum-half saw space in behind a ruck to chip, gathered the ball and fed Mefin Davies steaming up behind him.
We are also getting a number of design wins in avionics, and in one example the Japanese space agency is using an MRAM chip in a satellite launched into orbit early this year to measure carbon dioxide levels in the atmosphere.
It says the chip takes up 35% less space than its previous offerings.
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But a lot of space is occupied by a massive fan that the supersonic chip needs to keep cool.
While Intel has been dominant in desktops and notebooks with its x86 chip, it has lagged in the smartphone space.
Some exceptions to this are in the super dense space where PCI Express and ethernet are virtually on the chip, or solutions from guys like Calxeda, which minimizes power and eliminates the need for any comms box at the top of the rack.
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In the semiconductor industry, prices are always falling as chip companies scramble to cram more semiconductors into less space, allowing them to deliver more computing power per buck.
Using a new 3-D chip design that stacks more capacity in the same amount of space, Matrix claims that it can deliver packaged content faster and less expensively than masked ROM and avoid the moving parts that plague discs.
Which is why, according to Chip, companies like Independence IT are taking over the traditional technology space previously occupied by the local computer guy or technology firm.
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