This disposal process should in theory have no correlation with the Special Liquidator valuation and disposal process or indeed the Department of Finance.

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So they incorporate powerful data correlation and visualization methods that assist in this process.

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The test chip will enable the correlation of the simulation models to the FinFET process and contains test structures, standard cells, a PLL and embedded SRAMs. The memory instances include high-density SRAMs designed to operate at very low voltages and high-speed SRAMs to validate the process performance.

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