The upcoming vote pits the newly reconstituted board and turnaround management team at Tessera, a technology development and licensing firm that invented chip-scale packaging (CSP) technology for improved semiconductor performance in the 1990s and is now blazing a trail in advanced semiconductor interconnect technology, against a board takeover attempt by the activist hedge fund Starboard Value LP.

FORBES: Don't Turn My Company Into A Patent Troll!

The new standard will enable next generation systems to achieve greater performance, significantly increased packaging density and improved reliability - with lower power consumption.

ENGADGET: JEDEC announces final DDR4 RAM specification