In a process similar to printing a photograph, engineers beam high-powered light through a mask-like image of the chip, creating a duplicate on a silicon wafer.
This involves shining light through a patterned mask and on to the surface of a chip, so as to change the chemical properties of the exposed parts of that chip.
The mask is designed so that light passing through its thickest region is slowed by exactly two cycles compared with that passing through its thinnest.