We continue to capture all opportunities possible related to the ongoing and broadening transition from gold to copper and look ahead at wedge bonder volume improvements, LED expansion and advanced packaging growth opportunities.
The mortgage fraud task force I announced in my State of the Union address retains its full authority to aggressively investigate the packaging and selling of risky mortgages that led to this crisis.
One can envision these new players in the industry will assume leadership in specific roles within the value chain: Intel-like semiconductor companies building the LED chips, and equivalents of a PC motherboard manufacturer like ASUS packaging the chips into devices that will be used in a variety of end-use lighting applications.
Other consumer trends have included a demand for recyclable packaging, flavor variety, and more ready to drink options that have subsequently led to more product innovations in the beverage space.
The packaging and testing phase account for close to 60 percent of the cost of an LED today so unified semiconductors would further help drive down unit costs, while increasing throughput.