Warnings that we may face civilisation-threatening temperature change by the end of the century, once considered outlandish, are now coming out of mainstream research groups.
And because the gate and the insulation layer are formed right at the end of the chip-making process, after the high-temperature steps have been completed, it is possible to choose from a wider range of materials for the insulation layer.
And the benefits, when estimated using a standard climate model, will reduce temperature only by an immeasurable one-tenth of a degree Fahrenheit by the end of the century.