Implemented in a 28nm manufacturing process, the chipsets will feature significant improvements in performance and power consumption from previous generations and provide support for multiple mobile broadband technologies to deliver a best-in-class mobile broadband experience for smartphones, tablets, ultra-portable notebooks, portable hotspots, dongles and CPEs (Customer Premises Equipment).
ENGADGET: Qualcomm's Gobi modem chipsets combine 84Mbps HSPA+, LTE-Advanced