这一现象的发现对我们今后在集成电路镍铬合金薄膜电阻的设计优化方面具有较高的参考意义。
In the process of manufacturing Ni-Cr alloy filmresistances of IC by using magnetronic sputtering, the film resistive property has been found having a regular change after annealing process.
这一现象的发现对我们今后在集成电路镍铬合金薄膜电阻的设计优化方面具有较高的参考意义。
In the process of manufacturing Ni-Cr alloy filmresistances of IC by using magnetronic sputtering, the film resistive property has been found having a regular change after annealing process.
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