应用于片式元器件的前处理、镀银、镀镍、镀锡等工艺。
Pretreatment, silver plating, nickel plating and tin plating of chip components.
集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
Gold, silver and nickel plating of IC lead frame and package shell.
集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
Gold, silver and nickel plating of IC lead frame and package shell.
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