拟合了负载力变化曲线，为模内键合工艺液压系统特性分析提供了负载力输入数据。
Fitting the load curve in order to provide data for the hydraulic system analysis. 3 Design the hydraulic core moving system integrated in the injection machine.
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料，包括金丝、铜丝和铝丝。
Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
从静电驱动的角度阐述此种反射镜的结构设计原理，并对具体加工中的腐蚀和键合工艺进行了详细讨论。
The design of structure was put forward from the theory of electrostatic actuating and some aspect associated with the process such as etching and bonding were discussed in details.
介绍了晶圆键合工艺、技术要求、应用选择以及对MEMS的作用；展示了MEMS制造技术和应用前景。
Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.
介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
Four fundamental manufacturing technologies namely bulk micromachining, surface micromachining, moulding and wefar bonding are introduced for Micro Electro Mechanical System(MEMS).
最后，进行了阳极键合、金-硅键合试验，研究了试验中影响键合强度的关键因素，提出了较为可行的键合工艺。
Finally experiments of anodic bonding and Au-Si bonding have been carried out to find out the key factors related to the bonding strength, and the most feasible bonding manners are put forward.
由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数——焊盘间距也不断缩小以满足市场要求。
As the demand increasing steadily for small volume, high density and high heat-dissipation rate IC, the key parameter of wire bonding — pad pitch has to shrink in accordance.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
在MEMS器件的设计与加工过程中，键合技术是体硅工艺的一项关键技术。
In the design and fabrication of MEMS devices, MEMS fabrication process based on Silicon is a main technology, to which is deeply paid attention by researchers and industries.
最具竞争力的转移固体薄膜技术主要有键合加选择性腐蚀工艺和注氢智能剥离工艺。
The most competitive technologies of transferring solid membrane mainly include bond and etch process and smart cut process.
硅片键合往往与表面硅加工和体硅加工相结合，用在MEMS的加工工艺中。
The silicon bonding technology is generally combined with surface silicon machining and bulk silicon machining in MEMS.
提出了一种基于北京大学硅玻璃键合深刻蚀释放工艺的扩展工艺，用来加工微型隧道加速度计。
A tunneling accelerometer is fabricated and characterized based on the extension of the silicon-glass anodic-bonding and deep etching releasing process provided by Peking University.
晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
器件键合失效主要表现为温度试验后管壳上的键合点脱落，而引起失效的原因与工艺过程和键合所涉及的材料有关。
The wire bonding failure of devices is mainly shown as the breaking off of wire bonded on the packages after temperature test, and the failure causes are related to wire bonding process and materials.
针对微加工工艺过程造成的残余应力，文中提出了喇曼在线测量方法，并对最常用的三种微加工工艺：淀积、腐蚀或刻蚀及键合进行了喇曼在线测量。
This paper puts forward an online measuring method for measuring the stress in silicon samples prepared with three common micromachining processes: deposition, etching, and bonding.
利用微机械体硅工艺及键合技术，把系统中的测试机构、加载机构以及力传感器集成在一个单一的芯片上。
The loading structure, testing part and force sensors were all integrated on a single chip by bulk silicon technology and bonding process.
介绍了舵柄与舵杆无键液压套合工艺的优点。
This article describes the advantages of the fitting of keyless tiller with rudder stock by oil shrink method.
分析了金硅共晶键合的基本原理，讨论了键合实验的基本工艺，给出了键合的测试结果。
The principle of eutectic bonding was analyzed. The fabrication process of eutectic bonding was discussed, the test result of eutectic bonding was given.
在众多的改进工艺中，运用激光实现键合是颇具特色的一项工作，目前也是激光在封装研究领域的热点之一，特别值得关注的一个方向是激光键合在生物mems领域中的应用。
Among numerous betterment technics, applying laser for bonding is a characteristic work, also is one of pop encapsulation researches, in which should pay more attention to application in biology MEMS.
传感器的结构建立在SOI材料上，在关键工艺中采用硅熔融键合技术。
The structure, which is fabricated on the SOI material, and its fabrication process have been designed based on the theoretical analysis.
激光局部键合是有效降低键合温度的一种重要工艺。
Laser localized bonding is an important technology to reduce the high temperature adverse effect in bonding process.
引线键合过程中的工艺参数较多，他们直接影响键合质量的好坏，影响半导体器件的可靠性。
There are so many process parameters affecting bond quality in wire bonding and these parameters are directly related to the reliability of semiconductor device.
从应用开发MEMS产品的实用角度出发，介绍了利用硅一硅键合技术制作的微型电容式压力传感器，给出了详细的制作工艺及主要工艺步骤图。
Introduced the capacitive pressure microsensor produced by Si-Si bonding technology in terms of the practicality of MEMS products. The producing technology and major diagrams were given in detail.
从应用开发MEMS产品的实用角度出发，介绍了利用硅一硅键合技术制作的微型电容式压力传感器，给出了详细的制作工艺及主要工艺步骤图。
Introduced the capacitive pressure microsensor produced by Si-Si bonding technology in terms of the practicality of MEMS products. The producing technology and major diagrams were given in detail.
应用推荐