此单元组还包括操作预先组合好的生产焊接，钎焊和锡焊设备的机器操作员。
This unit group also includes machine operators who operate previously set up production welding, brazing and soldering equipment.
将电路板放置在焊台上，针对需要焊接的通孔元件管腿，选择合适的喷锡口，启动波峰焊接。
The circuit board is placed in the welding stage, the pins through hole components welding, choose appropriate spray tin, soldering start.
适用于铜材的焊接，例如铜和锡铜合金，尤其是用于铜锌合金和钢的连接焊。
Suitable for welding of copper materials, for example copper and tin bronzes , especially used for joining of copper zinc alloys and steels.
焊接机器人、BGA返修台、自动点胶机、视频显微镜、吸烟系统、焊台、锡炉、超声波清洗器。网络测试工具等。
Solder Robert, BGA rework station, Automatic Glue dispenser, Video Microscope, Fume absorber, Soldering station, Solder pot, Ultrasonic cleaner, Cable tester, etc.
统计分析了焊接缺陷主要是表现为锡球断路、焊锡过流、锡球分布不对称以及烧焦和锡溅，主要受锡球大小、焊盘相对位置以及有关加工参数的影响。
By statistical analysis, the defects are tin-ball short, overflowing, dissymmetry, splash and scorch, which are mainly affected by the tin-ball size, pad positions, and process parameters .
以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
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