锡焊料从抵抗防止导体间，从而营造桥短路。
The solder resist prevents solder from bridging between conductors and thereby creating short circuits.
当锡焊料开始流动，移开电烙铁，使该位置降温冷却。
When the solder flows, remove the iron and let the area cool.
方法准确、可靠、简便、快速，完全适用于银锡焊料中微量铅的检验。
The method is proved to be accurate, reliable, convenient and quick, absolutely suitable for the assaying of trace lead in silver tin solder.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
现在，紧按住电烙铁顶压在接头上，同时让余下的锡焊料的“空闲”的未端去接触接头的另一侧。
Now press the hot iron firmly against the splice while letting the free end of your solder rest against the other side of the joint.
在电子电器领域，产品制造过程零配件之间连接导通工艺中的铅锡焊料所引起的环境污染越来越引起人们的重视。
In the electrical and electronic fields, Pb-Sn solder which is used to connect parts in the product manufacturing process can cause environmental pollution, which has drawn increasing attention.
向焊料槽中添加纯锡可以对合金进行控制。
通过这个电镀共沉积的过程，我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。
Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.
本发明涉及一种铜颗粒增强型锡银锌复合焊料及其制备方法。
The invention relates to a copper particle reinforced type tin, silver and zinc composite solder and the preparation method.
本发明涉及一种碳化硅颗粒增强型锡银锌复合焊料及其制备方法。
The invention relates to a silicon carbide particle reinforced type tin, silver and zinc composite solder and the preparation method.
该装置(1)可使溶出于包含以锡作为主成分的无铅焊料中的铜作为金属间化合物析出以分离铜。
The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.
仪表适用于测量氨的液体和气体的压力真空，也可测量对碳钢、奥氏体不锈钢和锡铅类焊料无腐蚀作用的介质的压力和真空。
It is used for pressure and vacuum of ammoniac liquid and gas as well as of zhe madia which can't corrode carbon steel, stainless steel and solders like tin and lead.
在锡铋系焊料中加入微量元素，通过快速冷却制成新的焊料，并对其组织与性能进行了研究。
A new type of solder was fabricated by adding microelements into tin-bismuth series solder and then being rapid cooled.
本文报告了一种基于低温共烧陶瓷技术和金锡共晶焊料的射频微机电的封装技术，并评估了该封装结构的物理及射频特性。
This paper reports on an RF MEMS package based on LTCC technology and gold-tin eutectic bonding, and also evaluates physical and RF characteristics of the proposed structure.
进入21世纪，由于环境保护的要求，锡铅焊料将逐步被无铅焊料所取代。
Due to the consideration of environmental protection, the substitution of lead-containing solder with lead-free solder has become an inevitable trend in the 21st century.
对多种锡铅焊料进行一系列不同条件下的漫流性试验 ，分析它们在铜表面上的铺展状况 ，最后归纳出焊料成分、钎焊温度、助焊剂对软钎焊料漫流性影响的规律。
The results show that the melting properties of the solder alloy are satisfactory, and the soldering temperature and time have much effect on the shearing-strength of the joints.
你将可能会不得不使用到“吸锡球器”和适当的焊料灯芯(通常为细铜编织带)，以帮助移动你将要替换的原来组成部件。
You'll probably have to use a "desoldering bulb" and an appropriate solder wick (typically, a fine-woven copper strap) to help remove the original components you're replacing.
作为目前广泛使用的耗时长的固体贴装预制件的代替品，一种用电镀共沉积得到的金锡合金共晶焊料被用于该项研究中。
As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic au-sn alloy was used in this study.
氮气循环使用，增加无铅焊料的侵润性和流动性，使锡点饱满光亮。
Circulated nitrogen system is designed to improve the wettability and fluidness of lead-free solder and to ensure that the solder joints are shiny and bright.
氮气循环使用，增加无铅焊料的侵润性和流动性，使锡点饱满光亮。
Circulated nitrogen system is designed to improve the wettability and fluidness of lead-free solder and to ensure that the solder joints are shiny and bright.
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