本文介绍了核辐射使电子元器件失效的机制以及离子束分析技术在抗核加固研究中的若干应用。
The mechanism of radiation damage effects on electronic devices and the applications of ion beam analysis in the investigations of radiation hardening were presented in this paper.
对两者的关键技术和优缺点进行了比较，并针对国内外集成电路抗辐射加固筛选技术的现状给出了一些建议。
The key technology, advantages and shortcomings of the two methods are described in contrast, and some advices are given with the state-of-the-art of the screening technology.
对两者的关键技术和优缺点进行了比较，并针对国内外集成电路抗辐射加固筛选技术的现状给出了一些建议。
The key technology, advantages and shortcomings of the two methods are described in contrast, and some advices are given with the state-of-the-art of the screening technology.
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