超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。
This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital image Processing and Pattern Recognition.
本课题的目的在于如何保护湿法腐蚀中芯片的焊盘和结构。
The purpose of this paper is to find ways to protect the pad and the structures on chip during the wet etching.
由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数——焊盘间距也不断缩小以满足市场要求。
As the demand increasing steadily for small volume, high density and high heat-dissipation rate IC, the key parameter of wire bonding — pad pitch has to shrink in accordance.
当封装芯片置于系统中时，还完成将ESD保护装置从输入焊盘断开。
Also to perform disconnection of ESD protection device from input pad once the packaged chip is placed in system.
在介质涂层上设置电路，后者包括芯片安装焊盘，连接焊盘和连接它们的电路迹线。
Electrical circuitry is disposed on the dielectric coating, said circuitry including chip mounting pads, connection pads and circuit traces connecting the chip mounting pads to the connection pads.
在介质涂层上设置电路，后者包括芯片安装焊盘，连接焊盘和连接它们的电路迹线。
Electrical circuitry is disposed on the dielectric coating, said circuitry including chip mounting pads, connection pads and circuit traces connecting the chip mounting pads to the connection pads.
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