首先，它使10到百分之20更小的芯片尺寸，他说。
First, it enables 10-to-20 percent smaller die sizes, he said.
半导体器件，半导体晶片，芯片尺寸封装及制作和检测方法。
Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor.
蓝牙芯片尺寸小，功耗低，组网方便，没有特别的通讯视角和方向要求。
The bluetooth chip is small in size, low power dissipation, it is convenient to establish network, it hasn't special communication visual Angle and direction required.
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
在此标准化过程的方方面面都贯穿着对降低成本、复杂度和芯片尺寸的强调。
The emphasis on minimizing cost, complexity and chip size is permeating all aspects of the standardization process.
切割出的芯片尺寸精确，一致性好，切割断面光滑、平整，不损伤内层电极。
The cutout chips are characterized by precise sizes, good consistency, and the cutting section is bright, smooth, and flat, without injuring the internal-layer electrode.
芯片尺寸、功耗的不断减少和芯片成本的不断降低是集成电路设计的基本目标。
The continuous decreasing of cost, size and power dissipation is the develop trend of IC design nowadays.
圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。
This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.
新的三星内存ufs满足需求的超速度快，容量大，结构紧凑芯片尺寸的中高端智能手机。
The new Samsung UFS memory satisfies needs for ultra-fast speed, large data capacity and compact chip size in high-end smart phones.
布线器为没有对齐的引脚创建直角走线来弥补，直角走线强迫了通道在垂直方向上扩大并且增大芯片尺寸。
The router creates jogs to compensate for pins that are not aligned. This forces the channels to expand vertically and increases the die size.
这是相当明显，南部群岛的芯片尺寸将变得更大，将极有可能消耗比前辈只是由于目前的工艺技术使用更多。
It is rather obvious that the Southern Islands chips sizes will grow bigger and will highly likely consume more than predecessors simply due to usage of current process technology.
但是现在，随着承载重要计算能力的芯片尺寸缩小到几乎可以忽略不计，大家几乎可以把任何东西变成一台电脑。
But now, as the size of meaningful computing power approaches zero, you can turn anything into a computer.
部分原因是由于在更小的芯片尺寸，新IRED是一种低成本的替代欧司朗的SFH 4715A用于中档输出要求的系统。
Due in part to the smaller chip size, the new IRED is a lower-cost alternative to Osram's SFH 4715A for systems with mid-range output requirements.
与此同时，AT I公司的功能已经到位，并将其芯片尺寸缩小到四分之一是他们在2900年，或一半，他们是在R770。
Meanwhile, ATI has those features already in place, and it will shrink its chip sizes to a quarter of what they were in the 2900, or half of what they were in the R770.
芯片尺寸改变时，PB -GA121焊点的最大应力值随芯片尺寸的增大而增大，但PBGA81的最大应力值随芯片尺寸增大先减小后增大。
The maximum stress of PBGA121 soldered joints increases when chip size increases, while the maximum stress of PBGA81 soldered joints decreases first and then increases.
芯片尺寸改变时，PB -GA121焊点的最大应力值随芯片尺寸的增大而增大，但PBGA81的最大应力值随芯片尺寸增大先减小后增大。
The maximum stress of PBGA121 soldered joints increases when chip size increases, while the maximum stress of PBGA81 soldered joints decreases first and then increases.
应用推荐