这也就是说，我们都在寻求一种方案，使得在今天的芯片密度条件下可以实现并行处理。
That is, we are all looking for a way to exploit the parallelism made possible by today's chip densities.
第一种是FPGA，由于不断增加的芯片密度和改进的软件工具，使得它在图像处理中的应用越来越广泛。
First is FPGA. The increment of chip density and improvement of software makes it used more widely in image processing.
POWER 7在每一个芯片或插槽上增加了处理器内核密度，改进了多线程支持，并且改进了内核内存带宽(下面介绍)。
POWER7 provides increased processor core density per chip or socket, improved multithreading support, and improved core memory bandwidth (discussed below).
据三星预计，2012年三星将有10%的内存芯片产品是基于4gb及更高容量密度的芯片。
Samsung expects to have more than 10 percent of its total DRAM chip production in 2012 at the 4gb (or higher) density.
三星宣布了世界上密度最高的DRAM芯片，4GBDDR3模块，以50纳米技术制造，为现有DDR3芯片容量的2倍。
Samsung has announced the world's highest density DRAM chip, a 4GB DDR3 module, which is manufactured using a 50nm technology and is double the size of previously available DDR3 chips.
不过他表示闪存业者会使用液浸式光刻机制造位密度在64 - 128gbit的闪存芯片产品。
However, he did say chip makers expect to ship 64 and 128 Gbit flash devices using immersion tools.
考虑到制造电脑芯片的费用，精密度和困难程度，你可能会认为设计芯片的工程师都是很严肃的人。
Considering the expense, precision and difficulty of manufacturing computer chips, you would think the engineers designing them are pretty serious people.
在冲向这堵墙的过程中，为了保持速度，通过把集成电路堆叠起来增加密度，闪存业已开始制造三维芯片。
To keep up speed on the way to the wall, the industry has begun building three-dimensionalchips by stacking circuits on topof one another to increase densities.
东芝还表示，东芝方面采用19nm制程制作的2位元型64gbit密度NAND芯片样品将于本月底对外供应，而产品的量产则定于今年第三季度进行。
Toshiba said samples of 2-bit-per-cell, 64-gbit line will be available at the end of this month, with mass production scheduled for the third quarter of the year.
这是目前为止市面上第二款基于20nm级别制程的NAND闪存芯片产品，另外一款则是IMFlash生产的64Gbit密度的25nm制程产品。
This is the second NAND flash device in production at the 20-nm class, joining a 64-Gbit 25-nm multi-layer cell NAND Flash from IM Flash Technologies, according to UBM TechInsights.
方法利用低密度脂蛋白作用人血管内皮细胞系ecv304，通过基因芯片分析人信号传导相关蛋白的表达谱。
Methods Microarray analysis on human signal transduction associated proteins was applied to profile changes in gene expression of human ECV304 endothelial cells induced by low density lipoprotein.
在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.
也就是说，这种趋势就是通过提高晶体管的密度使芯片更小，并消耗更少的电能，也就意味着可以将手机做得更小，电池续航时间更长。
That is, the tendency is to use the increased density to make the same chip smaller and consume less power, to make phones smaller and make batteries last longer.
随着IC的高速化、高集成化、高密度化和高性能化，芯片内互连线之间的串扰已经成为影响芯片性能的重要因素之一。
With the IC's higher speed, higher integration, higher density and higher performance, crosstalk has become one of the most important factors which can influence the IC's performance.
微通道热沉是解决高热流密度微电子芯片散热的一种有效途径。
Microchannel heat sink is a promising technique to dissipate high heat flux microelectronic chips in the near future.
目的运用低密度表达谱芯片检测人脑原发胶质瘤组织中DNA损伤修复基因的表达情况，进一步分析其表达变化的意义。
Objectives to detect the expression of DNA repair genes in primary glioma tissues by low-density array, and to analyze the significance of the expression.
随着芯片集成度及整机安装紧凑性的提高，计算机发热密度近年来一直呈指数级增长。
With the increase of chip integration level and packaging density, the heat density generated in computer keeps increasing exponentially in recent years.
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
因此，它们具有打造下一代高密度、非易失存储芯片和模仿生物神经节的逻辑电路的潜力。
As a result, they could potentially underpin a new generation of high density, non-volatile memory chips and logic circuits that mimic biological synapses.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
该卡是以高密度高性能的FPGA芯片为核心，图像采集芯片、图像输出芯片、PCI桥芯片、DDR动态存储器等为辅助的PCI扩展卡。
The card is PCI add card, comprised with the core chip, a high density high capability FPGA, and the image collect chip, image output chip, PCI bridge chip and the DDR RAM.
在3d -MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。
In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
通过对125例血细胞减少症患者的组织芯片自动图像分析进行CD271+MSC密度定量检查：包括40例低级别的MDS（<5％的骨髓原始细胞），24例高级别的MDS和61例良性MDS。
CD271+ MSC density was quantitated by automated image analysis of tissue microarray cores in 125 cytopenic patients: 40 lower grade MDS (<5% marrow blasts), 24 higher grade MDS, and 61 benign.
本发明涉及可实现高密度化的芯片部件的安装构造以及安装方法。
Provided are a chip component mounting structure and a chip component mounting method for increasing density.
对高热流密度芯片的冷却要求进行了分析，采用有限元方法对微槽道冷却热沉的传热性能进行了数值模拟。
The finite element method is then used to numerically simulate the heat transfer performance of microchannels cooling heat sink.
以计算机芯片为例，传统的散热片与风扇组合式散热器已越来越显现出其弱点与局限性，必须求助于新的解决方案，实现高密度热量的转移。
Take computer chips for example, the traditional heat sink-fan cooler increasingly reveals its weaknesses and limitations, so we must put forward new solutions to deliver this high heat transfer flux.
结果显示，在优化的制备工艺和应用工艺参数的条件下，使用本文中高密度反应器生物芯片对本文中所用样品的检测，可达到100%的灵敏度和100%的特异性。
The research reveals that we had a sensitivity of 100% and a specificity of 100% in the reactor under a optimized producing condition and applying condition.
得到的研究结果可为建立高密度基因芯片脉冲点样技术提供实验研究基础。
The results in this paper can provide a experimental basis for establishing a high-throughput microarray pulse spotting technology.
得到的研究结果可为建立高密度基因芯片脉冲点样技术提供实验研究基础。
The results in this paper can provide a experimental basis for establishing a high-throughput microarray pulse spotting technology.
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