随着集成电路工艺与技术的飞速发展，集成电路已经进入系统级芯片阶段。
With the rapid development of semiconductor technology, integrated circuit has stepped into a new era of SOC.
介绍了系统级芯片的定义、优点、构成要素、设计原则、品种和目前存在的问题。
The definition, merits, essential factor to constitute, principle to design, variety and existent problem at the moment are introduced.
圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。
This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.
随着数据吞吐量不断上升以及系统低功耗要求，系统级芯片对存储器的需求越来越大。
With the increasing demand for large data throughput and the requirement of lower system power consumption, the embedded memory demand is increasing rapidly.
在系统级开发的过程中需要优先解决可测性问题，特别是设计系统级芯片会用到很多数字线路和IP内核。
In the process of system developing, the engineer should first solve the problem of DFT, especially when lots of digital circuits or IP cores are used in system On Chip.
针对传统系统级芯片动态内存管理单元(SOCDMMU)，提出用软件方法实现SOCDMMU中的核心部件。
Aiming at traditional System on Chip Dynamic Memory Manage Unit (SOCDMMU), this paper proposes realizing the core parts of SOCDMMU with the software method.
该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
系统级芯片(SOC)的设计大多采用以ip核为主的预定制模块，IP核已经成为未来主流芯片设计的核心构件。
Preorder module IP core is widely used in the design of System on chip (SOC), IP core is becoming the kernel component in the designing of future chip.
根据铁路车号自动识别的基本原理，采用ARM9工业级芯片AT91SAM9260设计开发了铁路车号识别系统的嵌入式系统；
The train identification system based on embedded system is designed with ARM9 RSIC CPU AT91SAM9260 under the principle of automatic train identification system.
论文针对目前大规模集成电路设计要求，结合电力电子应用，设计了一个SPWM信号产生系统IP软核，该软核可广泛应用于系统级芯片设计中。
According to the requirement of the VLSI and the wide application of power electronics, IP soft core of SPWM generation system is designed. And it can be widely applied in system level chip design.
本实验平台采用CYGNAL公司的一款完全集成的混合信号系统级芯片C 8051f 320作为主控芯片，同时采用AT 89 C51单片机作为可控硅触发板的控制芯片。
This platform USES C8051F320 device of CYGNAL as main control chip which is fully integrated mixed-signal System-on-a-Chip MCUs, and AT89C51 MCU as silicon control triggering control chip.
这证明了天线，无线电芯片，控制电路，和微米级的光源可以被集成在隐形眼镜镜片上，并且在眼睛上正常工作。
This verifies that antennas, radio chips, control circuitry, and micrometre-scale light sources can be integrated into a contact lens and operated on live eyes.
金说“我们证实了我们可以在单元芯片级做到这个。”
"We clearly demonstrated that we can do it at the unit chip level," says Kim.
可将其看作松耦合架构按比例缩小至芯片级。
Think about the loosely-coupled architecture being scaled down to the chip level.
英特尔公司(Intel)称其在晶体管技术中取得了重大突破——应用三栅级晶体管技术的3D芯片将进入量产阶段。 该技术首次亮相于2002年。
Intel claimed a breakthrough in transistor technology by announcing that it was ready to use its 3D Tri-Gate chip, first unveiled in 2002, in high-volume manufacturing.
我打赌它也从iPhone的销售中获得了版税—并且会一直这样，直到它的关键芯片级封装专利在2010年期满。
I'd bet it is reaping royalties from iPhone sales too — and will until its key chip scale packaging patent expires in 2010.
英特尔大规模生产质量过硬的芯片的能力意味着他们不再需要和二级生产商分享利润了。
Intel's ability to deliver good enough chips in large Numbers meant profits no longer had to be Shared with secondary manufacturers.
带有大量核心的计算机占据很大地位，而且事实上在芯片上可用的核心的数量呈指数级上升。
Computers with a large number of cores aren't going anywhere, and in fact the number of cores available on a chip will exponentially increase.
由于主内存和芯片级内存缓存之间的延迟差别，POWER 7设计了三种级别的芯片级缓存机制(见图1)。
Due to the latency difference between main memory and on-chip memory cache, POWER7 was designed with three levels of on-chip cache (see Figure 1).
DNA测序仪涉及在计算机硅芯片上打上纳米级微孔，然后使DNA链通过这些微孔来读取它们包含的遗传密码信息。
The DNA sequencer involves drilling tiny nanometer-size holes through computer-like silicon chips, then passing DNA strands through them to read the information contained in their genetic code.
怀特赛兹教授的“纸芯片”相对于其他“芯片级实验室”方案来说要更加简便，其他的方案大多需要复杂的生产工艺并使用了诸如玻璃、塑料那样笨重的材料。
Whitesides' paper chips are much simpler than other lab-on-chip projects, many of which require intricate production methods and heavier materials such as glass and plastic.
英特尔已经开始重点生产65纳米的芯片(AMD仍然在生产90纳米级)，而且计划在2008年生产45纳米的芯片。
Intel has already started shipping chips with features only 65 nanometres wide (AMD remains at 90nm) and plans to produce 45nm chips in 2008.
通过嵌入处理器芯片的光通信，建立Exaflop(1018次，是千万亿次petaflop的1000倍)级水平的高效能计算机系统的愿景将在不太遥远的未来实现。
With optical communications embedded into the processor chips, the prospect of building power-efficient computer systems with performance at the Exaflop level might not be a very distant future.
此外，现在的AMD还有上面提到的产品信誉问题，而除了入门级Geode处理器之外AMD从来没有在超便携芯片市场中有所作为。
In addition, AMD has the aforementioned credibility issue because the company never competed in ultramobile space with the exception of its Geode processors on the very low end.
这些手机都将采用Android 2.2系统或是其2.3升级版，配有4.3英寸显示屏以及双核处理器（摩托罗拉的DroidBionic甚至还配有NVIDITegra2的芯片）。
These devices all run Android 2.2, with likely upgrade or launch with Android 2.3, have 4.3 inch displays, and dual-core processors (the Droid Bionic even has the NVIDI Tegra 2 chip).
该芯片的判决电路采用SCFL(源级耦合晶体管逻辑)的D触发器结构，根据矢量叠加原理设计，采用差动电流放大器构成可调移相器。
The decision circuit of the chip is applied with a DFF using SCFL structure and its tuned phase shifter with differential current amplifiers according to the principle of vector addition.
图片缩放流畅性也比较不错。RK 2818芯片的整体处理速度不错，是入门级平板不错的选择。
Smooth image scaling is also quite good. RK2818 chip, the overall processing speed Yes, it is good choice for entry-level flat.
随着半导体技术和电子设计自动化（EDA）的迅猛发展，使系统级可编程芯片（SOPC）成为可能。
The tremendous development of semiconductor technology and electronic design automation (EDA) made the system on a programmable chip (SOPC) possible.
烟台洪发科技维修服务中心，是一家立足于IT产品芯片级维修技术的科技型企业。
Yantai Hong sends the technical service center, is one bases on the IT product chip level service technology science and technology enterprise.
烟台洪发科技维修服务中心，是一家立足于IT产品芯片级维修技术的科技型企业。
Yantai Hong sends the technical service center, is one bases on the IT product chip level service technology science and technology enterprise.
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