锡焊件、铅锡合金、锌压铸件、铍青铜、磷铜等合金在电镀前也常用预镀铜来改善结合力。
Tin welding parts and lead-tin alloy die casting, zinc, beryllium bronze, phosphorus copper alloy in electroplating copper with commonly used before also gets to improve adhesion.
结果表明，该添加剂工艺稳定性好，且镀层可焊性优良、抗变色能力强，可取代高污染的锡铅电镀工艺。
The result proves that the process has advantages of high stabilization, excellent solderability and antitarnishing, which may replace high-pollution tin-lead electroplating technology.
此法已被成功应用于测定锡-铜-铅合金电镀液及其镀层中的锡、铜和铅。
Cu and Pb ions in the alloy plating bath and composition of its deposits.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
在含有铅、锡、铜、镍和一些贵金属的电镀池中，甲磺酸(msa)是一种很好的电解质。
Methane sulphonic acid (MSA) has the right combination of properties for electroplating baths containing lead, tin, copper, nickel and some precious metals.
介绍了采用两种产品的电镀铅、锡及铅-锡合金工艺。
Lead, tin and tin-lead alloy electroplating technologies using these two products are introduced.
批发采购电镀助剂-供应666无铅无镍光亮厚白铜锡（电镀助剂）批发…
The lead-free nickel free white and bright nickel substitute plating process…bright nickel substitute tin salt 30g 666 lead-free nickel free white and …
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
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