对电镀合金后进行低温氮碳共渗，提高渗层耐磨性能以及模具中的应用效果也作了扼要介绍。
In addition, it introduces briefly the nitrogen and carbon co-penetration at low temperatures after the alloy plating for improving the wear-resisting and application results.
电镀：利用电解原理，使金属或合金沉积在制件表面，形成均匀、致密、结合力良好的金属层的过程。
Electroplating: use the principle of electrolysis, the metal and alloy parts deposition in the surface, form even, density, good adhesion of the metal layer process.
因此，电镀非晶态合金已引起人们的极大关注。
Therefore, amorphous alloy plating has aroused people's attention.
在铍青铜合金上电镀铝，需在镀铝前作特殊的表面活化处理，镀铬时也有不同于钢铁件镀铬的操作方法。
Special treatment is recommended to activate beryllium copper surface before chromium plating. And special steps which differ from conventional chromium plating on steel parts are to be taken.
当铜合金表面的电镀纯铜层厚度超过一个临界值，表面电镀纯铜处理可以明显改善材料的耐氧化剥离性。
As the electroplating pure copper layer on copper alloy exceeds a critical thickness, the surface electroplating treatment can improve the copper alloy's resistance against oxidation failure greatly.
氢脆：由于浸蚀，除油或电镀等过程中金属或合金吸收氢原子而引起的脆性。
Hydrogen brittleness: because, in addition to the erosion oil or plating process such as metal and alloy hydrogen atom absorption and cause brittle.
锡焊件、铅锡合金、锌压铸件、铍青铜、磷铜等合金在电镀前也常用预镀铜来改善结合力。
Tin welding parts and lead-tin alloy die casting, zinc, beryllium bronze, phosphorus copper alloy in electroplating copper with commonly used before also gets to improve adhesion.
将超声波应用于锡铈合金电镀。
综述了铁系锌基合金电镀的研究应用现状以及工艺的重要影响因素。
Current status and important influence factors of electroplating iron family metal containing zinc alloys are reviewed.
MLCI端头电极锡-铅合金电镀工艺及维护、镀后的清洗、MLCI的储存影响镀层的耐焊性和可焊性。
Solderability of Sn Pb alloy deposit is determined by electroplating process and its maintenance, post treatment rinsing, storage of MLCI, etc.
镉离子主要来源于电镀、电池、合金制造、颜料、采矿与选矿行业排放的工业废水。
Cadmium ion mainly comes from industrial waste water discharged by electroplating, battery, alloy manufacturing, pigment, mining and refining process.
阀体和内部零件：阳极电镀铝合金、铜。加固端盖：塑料。
Valve body and internal parts: anodized aluminum alloy, copper.
研究了超声波对锡铋合金电镀的影响。
The effects of ultrasonic on the tin-bismuth alloy electroplating are studied.
将超声和电沉积相结合电镀了锡铋合金。
Tin - bismuth alloy was electroplating by electrodepositing associated with ultrasonic agitation.
研究了用电镀法制取镍硼合金的可能性。
The possibility of the electroplating process applied to Ni-B alloy was studied.
在电镀过程中，镀液主盐离子浓度的变化对镀层的影响极大，对合金电镀更是如此。
The variation of concentration of main salt in electrolyte affects the quality of metal coating obviously, and it is for alloy plating coating as well.
研制了一种锌基合金电镀添加剂ea - 2。
Additive EA-2 for zinc based alloy electroplating was synthesized.
简述了铝及其合金电镀前处理的常见工艺。
Common pre-plating processes for aluminum and its alloy were introduced briefly.
本文总结了自1960年以来合金电镀方面的成就，详细论述了合金电镀的五大特点和四种类型的平衡状态图。
The achievements in alloy plating since 1960 is briefly summarized. Five main features of alloy plating and four types of equilibrium diagrams are illustrated.
我们要采购擦光化合物，电镀物品，光彩，金属口红，电渡金属和合金。
We want to buy Buffing Compounds, Electro, Lustre, Metal Rouge, Electroplating Metals and alloys.
研究了从焦磷酸盐槽液中电镀锡镍合金的一种新工艺，讨论了一些电镀参数对锡镍合金镀层的影响。
A new technology of tin-nickel alloy electroplating from a pyrophosphating bath was studied. The effect of some plating parameters on the tin-nickel alloy coating was discussed.
研究了一种镁合金表面直接电镀镍的新工艺。
A new process of direct electroplating on magnesium alloys was studied.
研究了稀土在硫酸盐体系电镀锌镍合金中的作用。
In this article, the effects of rare earth on Zn-Ni alloy electroplating from sulfate bath have been studied.
评述了这些电镀层对铀及铀合金的防腐蚀性能及保护机理。
The corrosion- resistant performance and mechanisms of these coatings for uranium and uranium alloys were evaluated.
介绍采用A - 1添加剂进行黑镍(镍钼合金)电镀的简便工艺。
A simple technology applying A-1 additive to Ni-Mo alloy plating is introduced in this article.
研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响。
The effects of surface electroplate pure copper on oxidation failure of lead frame copper alloys for IC package were investigated.
研究了一种新型可焊性光亮锡锑合金电镀工艺的镀液配方和电镀操作条件；
A new electroplating technology of solderable bright Sn-Sb alloy of bath components and operating conditions were studied.
此法已被成功应用于测定锡-铜-铅合金电镀液及其镀层中的锡、铜和铅。
Cu and Pb ions in the alloy plating bath and composition of its deposits.
此法已被成功应用于测定锡-铜-铅合金电镀液及其镀层中的锡、铜和铅。
Cu and Pb ions in the alloy plating bath and composition of its deposits.
应用推荐