本文结合生产实践，阐述了电铜长粒子是由电解电流密度不均、添加剂量不当和悬浮物超标等原因所致。
Such nodules cause serious influence on quality of cathode copper. This paper, combined with production practice, describes the formation of nodules on cathode copper and removal methods.
铜是电的良导体。
采用ICP—AES法准确、快速地测定电锌中的铝、铅、铜、镉、铁、锡等微量元素，并对方法的准确度和精密度进行了检验。
The Al, Pb, Cu, Cd, Fe, Sn etc trace element in the electrolytic zinc were accurately and quickly measured by using ICP-AES method.
分析了电锌厂铜回收的价值，指出铜在电锌生产中是有益元素，并阐述了铜回收的措施。
Analyzed the value of copper of recovery in electrolytic zinc smelter, made a conclusion that the copper was a valued element, mean while, described the method of copper recovery.
报道了一种新的高稳定的有机分子（SCN）可以和铜构成具有电双稳态特性的金属有机络合物。
In this paper, a new metal organic complex constructed by copper and a highly stable organic molecule SCN, was reported.
总结了萃取法和连续电积法两种铜电解液净化脱砷新工艺的特点，并进行了分析比较。
This paper summarizes the process features of purification arsenic removal of copper electrolyte by solvent extraction or continuous electrowinning and makes analysis and comparison.
电接点压力表适用于测量对铜及铜合金无腐蚀、无爆炸危险、非结晶的各种液体、气体等介质的压力。
USE: Electric- contact pressure gauges are used for measuring positive and negative pressure of liquids and gases which are nor corrosive to copper and copper alloy and not explosive and crystal.
从电接触的角度来看，铜基合金被用于接触导线和受电弓滑板的制造。
From the viewpoint of electric contact, copper base alloys have been applied to contact wires and also to pantograph sliders.
电雕不凸版，是先在铜暗地电雕，后举行镀铬，再经研磨加工而不败。
Electric carving gravure is first in the copper surface electric carving, chromeplate, and then after grinding.
作者对镀镍钢帽的物理性能进行了测试，并对镀镍钢帽电池和铜帽电池的电性能作了对比试验。
The properties of nickel plated steel cap were tested. And the electrical properties of nickel plated steel cap and copper cap for battery application were compared.
铜和银都是电的良导体。
抗阻尼性能强：金属钛受到机械振动、电振动后，与钢、铜金属相比，其自身振动衰减时间最长。
Strong antidumping property: When titanium is affected by mechanical vibration or electric oscillation, its vibration damping time lasts the longest time, compared to that of steel and copper.
细晶的合金组织有助于改善铜铬触头材料的电性能。
Fine microstructure is beneficial to improving the electric properties of contact materials.
通过实验手段，研究了稀土对电沉积法制备泡沫铜化学预镀工艺的影响。
The effect of rare earths on the chemical pre-plating process for electro-deposition of foamy copper was studied through experiments.
采用电位阶跃法研究了铜基体上柠檬酸及其钾盐的缓冲溶液中锑的电结晶过程。
The single potential method was adopted to study the electrocrystallization of Sb on the copper cathode from aqueous citric acid and potassium citrate bath.
铜铝结构热交换器存在着电偶腐蚀的倾向。
Some Cu-Al structures used in thermal exchangers may lead to galvanic corrosion.
结果表明，用本工艺制取的钨-铜触头具有接近理论密度的高密度、优异的物理机械性能和抗电蚀性。
The results show that the W-Cu contact produced possesses high density, excellent physical and mechanical properties and arc-erosion resistance.
影响铜电积电耗的因素是槽电压和电流效率。
The factors influencing electricity consumption in copper electrowinning are the voltage and current efficiency in electrolyzer.
目的研究铜针电栓塞血管的机制，为临床治疗提供参考依据。
Objective To investigate the mechanism of electrothrombosis by copper needle, in order to supply the referential data for clinical treatment of vessel deformity.
如果用金属磨料如钢砂冲击铜质螺旋桨会在铜表面上残留，会与铜发生电偶腐蚀。
If such as metal abrasive is used in sand washing, itwill remain on the surface of the copper propeller, then galvanic corrosionwill occur with Cu.
用旋转圆盘电极法研究了激光照射下铜的电沉积过程。
An electrodeposition process of copper under a laser beam was studied by using a rotating disk electrode.
体积小、重量轻，节省铜与钢耗材，电效率高，一次充电可续路程长，爬坡性能强。
Volume small, weight light, saves the copper and the steel consumes the material, the electricity efficiency high, a charge may continue the distance long, the hill climbing performance is strong.
什么都杀不了你…从无线电广播站里世界逃出铜杯5。
Whatever Doesn't Kill You... Escaped the Radio Station Otherworld. Bronze 5.
介绍电液比例控制技术在铜电解阴极板自动线冲铆机上的应用，分析了电液比例压力控制系统的设计特点。
This paper introduces the use of electrohydraulic proportional control system to copper electro - cathode board die machine in the automatic product line.
由物性参数看出，该区实施激电测量，寻找铜硫化物矿产的物性前提是具备的。
These geophysical parameters indicate that conditions are available in these areas for prospecting copper sulfide deposit using induced polarization method.
综述了铜在芯片微刻槽中电沉积填充的过程、机理 ，并着重讨论了实现无裂缝和无空洞理想填充的主要因素—镀液的组成和添加剂的影响。
The procedure and mechanism of copper filling in the trench of the chip are reviewed, the effect of electrolyte components and additives on superfilling are discussed.
针对某难分选的铜锌矿石，提出一种混合浮选—氧化焙烧—选择性浸出—铜、锌电积选冶联合新工艺。
For a certain refractory Cu-Zn ore, a new process of bulk flotation-oxidizing roasting-selective leaching-Cu-Zn electrowinning is proposed.
铜母线和母线支柱应能承受50千安及以上的三相对称短路电流所产生的电应力。
Copper busbar and busbar column should be able to sustain electric stress generated by electric current of three-phase symmetrical short-circuit of 50 kiloampere and above.
覆晶封装中电迁移效应导致之铜溶解现象本論文报导覆晶封装之焊点中电迁移所引起之铜垫层快速溶解现象。
Electromigration induced Cu dissolution in flip chip Packages The phenomenon of Cu dissolution induced by electromigration at flip chip solder joints is reported.
在铜斑蛇微型带有一个方便的电启动发动机和新设计的控制面板，使机器操作更容易。
The CopperHead XD comes with a convenient electric start motor and the newly designed control panel makes operating the machine even easier.
应用推荐