如果反扩散和自增湿产生的水的量不小于电迁移的量，就能实现自增湿操作。
If the water amount of back-diffusion together with that generated through self-humidifying is larger than that through electro-osmotic drag, then the fuel cell could operate stably.
介绍了研究集成电路互连线电迁移的两种方法：加速寿命试验和移动速度试验。
Two main methods, accelerated lifetime test and drift velocity test, to study electromigration are described.
借助于脉冲波形的傅里叶级数分解，研究了一般交流应力条件下金属化电迁移的影响因素，建立了一般交流应力条件下金属铝膜电迁移寿命模型。
Metal Aluminium film EM in general AC stress has been researched with Fourier decomposition, developing a Metal Aluminium film EM life model under in general AC stress.
其中SO_2荷电迁移、自由基氧化、湿法吸收是去除SO_2的三个主要机理。
Desulfurization Mechanism is that SO_2 is charged and moved, oxygenized by free radicals, absorbed by liquids.
金属薄膜互连的电迁移现象是VLSI最重要的可靠性问题之一。
Electromigration in metal thin film interconnection is one of the important problems for VLSI reliability.
作为VLS I互连线的金属薄膜的截面积越来越小，其承受的功率密度急剧增加，使得电迁移成为电路的主要失效模式之一。
Consequently, the metal interconnects of VLSI have smaller sectional area and carry increasing power density, which made the electromigration become one of the main latent damage modes.
讨论了毛细管等电聚焦中所涉及的问题，如分离机理、电渗、迁移方法、检测器及其应用。
Separation mechanism, manipulation of electroosmosis, mobilization methods, detectors and some problems associated with the determination of samples are discussed.
电迁移是金属原子沿着电流方向的移动。
Electromigration is the movement of metal atoms in the direction of current flow.
采用硅化物阻挡层和A1多层金属布线方法，解决了欧姆接触和铝的电迁移问题。
And by the means of silicide, resist layer and aluminium multilayer metal lines, the questions of ohmic-contact and A1 electron mobility are resolved.
放电电场之后的辅助匀强电场有助于改善SO2的电迁移效果。
Assistant uniform electric field below the corona discharging electric field helps to improve the effect of SO2 electric transfer.
针对这个问题，本文首先介绍了IR压降和电迁移现象的产生原因及其影响因素。
Therefore, the reasons and the influencing factors of IR-drop and electromigration are discussed firstly.
理论计算和实验证明夹杂物的电磁迁移是电熔剂净化技术中的主要机理。
The results of calculation and experiment proved that the electromagnetic migration of the inclusions is the main mechanism of the electro-flux method.
不同焊点的温度差异引起了阴极界面的原子净流量和IMC的生长速率差异，导致不同焊点的电迁移程度差异。
The different temperature generates the difference of atomic fluxes and IMCs growth rates at the cathode, which also causes the nonuniform electromigration degree in different solder joints.
讨论了常见的组装缺陷和电迁移现象产生的原因及其预防措施。
Discuss some assembly defects and migration for causes and precaution.
配制四组不同混凝土配合比的试件，采用基于离子扩散和电迁移提出的NEL法对饱盐混凝土试件的氯离子扩散系数进行测定。
In this paper, four different ratio groups of concrete specimens are tested, using NEL method which is based on ion diffusion and electrical migration.
配制四组不同混凝土配合比的试件，采用基于离子扩散和电迁移提出的NEL法对饱盐混凝土试件的氯离子扩散系数进行测定。
In this paper, four different ratio groups of concrete specimens are tested, using NEL method which is based on ion diffusion and electrical migration.
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