文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。
In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.
表面贴装印制板设计直接影响焊接质量，将专门针对表面贴装印制板的焊盘设计、布线设计、定位设计、过孔处理等实用技术作一些探讨。
Design of surface mount PCB makes an impact on soldering quality. The design of soldering pad, track layout, location and through hole treatment are discussed.
焊盘的谐振输出是系统设计的关键。
通过完成电路中的各功能模块和焊盘的合理放置，对开关电源监控电路的版图进行了优化设计。
The layout design of the switch mode power supply is optimized through arranging function blocks and pads reasonably.
重点介绍了三种焊管端面内外倒角刀盘的设计、安装与对刀，并对各刀盘的特点和应用场合进行了比较。
The design, installment and position of three kinds of cutter adapters used to machining welded steel tube's faces are introduced. Their characteristics and fields of application are also compared.
设计了原位电阻测试电路，分别考察对比了三种焊盘所形成接头的电阻变化率。
To evaluate the bond properties, the circuit of in-situ resistance measurement was designed. The resistance variations of the bonds obtained with the three kinds of pads were measured.
设计了原位电阻测试电路，分别考察对比了三种焊盘所形成接头的电阻变化率。
To evaluate the bond properties, the circuit of in-situ resistance measurement was designed. The resistance variations of the bonds obtained with the three kinds of pads were measured.
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