表面贴装印制板设计直接影响焊接质量，将专门针对表面贴装印制板的焊盘设计、布线设计、定位设计、过孔处理等实用技术作一些探讨。
Design of surface mount PCB makes an impact on soldering quality. The design of soldering pad, track layout, location and through hole treatment are discussed.
这可以从不同的焊接到焊盘尺寸为最大功率耗散，和灰给定的最小焊盘尺寸。
This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
统计分析了焊接缺陷主要是表现为锡球断路、焊锡过流、锡球分布不对称以及烧焦和锡溅，主要受锡球大小、焊盘相对位置以及有关加工参数的影响。
By statistical analysis, the defects are tin-ball short, overflowing, dissymmetry, splash and scorch, which are mainly affected by the tin-ball size, pad positions, and process parameters .
如果这个块焊接至布线基板上的焊盘，焊料将沾湿于柱状块上表面整个区域，和侧表面的部分区域。
If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.
如果这个块焊接至布线基板上的焊盘，焊料将沾湿于柱状块上表面整个区域，和侧表面的部分区域。
If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.
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