研究了温度循环载荷下叠层芯片封装元件(scsp)的热应力分布情况，建立了SCSP的有限元模型。
A finite element modeling of SCSP was performed. The distribution of thermal stress of SCSP under temperature cycle was analyzed.
实验温度为室温，循环应变比和应力比均为0.1，载荷波形为三角波。
The fatigue tests were performed at room temperature and cyclic strain and stress ratio of 0.1 with triangle load wave.
目的研制冷热循环机械载荷咀嚼模拟疲劳试验机来人工模拟口腔环境的温度变化和咀嚼负荷，检测口腔材料的疲劳寿命。
Objective to design a new kind of thermocycling and mechanical loading (TCML) chewing simulator and test the chronic fatigue characteristics of dental materials and prosthesis.
分析了在热载荷作用下双金属复合钢管结合强度的变化，研究了经历温度循环后内外层管之间出现松脱的可能性；
The change of glued strength of bimetal composite pipe under the action of heat load was analyzed in this article.
[28]王凯，闫志峰， 王文先， 等。循环载荷作用下镁合金温度演化及高周疲劳性能预测[J]。材料工程，2014，（1）：85-89。
WANG K, YAN Z F, WANG W X, et al. Temperature evolution and fatigue properties prediction for high cycle fatigue of magnesium alloy[J]. Journal of materials Engineering, 2014, (1):85-89.
结果表明，循环载荷下的裂纹扩展速率对试验频率、载荷比、温度及橡胶夹层厚度反映较敏感。
It was shown that crack growth rate increased as the temperature or limit load rate increased. It was also that crack growth rate decreased as rubber thickness and loading rate increased.
结果表明，循环载荷下的裂纹扩展速率对试验频率、载荷比、温度及橡胶夹层厚度反映较敏感。
It was shown that crack growth rate increased as the temperature or limit load rate increased. It was also that crack growth rate decreased as rubber thickness and loading rate increased.
应用推荐