提出了用时序模拟法对电气主接线进行可靠性评估。
The paper presents a method to evaluate the reliability of bus configuration by the time sequential simulation.
该文以HSPICE电路模拟程序为电路模拟的基础，以改进的热点温度估算方法为热学模拟的基础，采用解耦法实现了集成电路的电热耦合时序模拟软件。
The HSPICE circuit simulator and an improved hot spot thermal analysis method were used in a new fast electro thermal relaxation method to study the self heating effects.
该文以HSPICE电路模拟程序为电路模拟的基础，以改进的热点温度估算方法为热学模拟的基础，采用解耦法实现了集成电路的电热耦合时序模拟软件。
The HSPICE circuit simulator and an improved hot spot thermal analysis method were used in a new fast electro thermal relaxation method to study the self heating effects.
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