以计算机芯片为例，传统的散热片与风扇组合式散热器已越来越显现出其弱点与局限性，必须求助于新的解决方案，实现高密度热量的转移。
Take computer chips for example, the traditional heat sink-fan cooler increasingly reveals its weaknesses and limitations, so we must put forward new solutions to deliver this high heat transfer flux.
以计算机芯片为例，传统的散热片与风扇组合式散热器已越来越显现出其弱点与局限性，必须求助于新的解决方案，实现高密度热量的转移。
Take computer chips for example, the traditional heat sink-fan cooler increasingly reveals its weaknesses and limitations, so we must put forward new solutions to deliver this high heat transfer flux.
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