引线成型需在焊接前完成。
概述微点焊接的工作原理和技术特点，以及用于薄膜铂电阻温度传感器中的薄膜基板上细小金属引线的微点焊技术。
This paper summarize principle and technical characteristics of precession welding machine, and emphases on precession welding technics of thin metal wire on pellicular PCB base?
严禁直接焊接引线或设备到电池上。
Direct soldering of wire leads or devices to the cell is strictly prohibited.
这种封装使焊接更加可靠，便于进行焊锡质量检查和用示波器探头接触引线。
This provides more reliable soldering, solder-quality inspection and easy access with oscilloscope probes.
适用于多层布线作细线导体，也适用于气敏传感器作电极和电极引线的焊接材料。
Applicable for thin multi-layer wiring conductor, also apply to gas sensors for welding electrodes and electrode-lead material.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
PC-Au - 4910金导体浆料适用于多层布线作细线导体，也适用于气敏传感器作电极和电极引线的焊接材料。
PC-Au-4910 gold conductor paste suitable for thin multi-layer wiring conductor, also apply to gas sensors for welding electrodes and electrode-lead material.
产品用途： 将已焊好引线的电容器芯子的引线焊到电容器盖子上。特点：焊接可靠，一致性好，效率高。对操作人员技术要求低。
Application : This machine is desinged for soldering the capacitors' terminals on the cover of the capacitors. Feature: Reliable soldering, good consistency of soldering, simply operation.
等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
引线自动剥皮后直接焊接在电容芯子上。
The lead, after being skinned, will be soldered on the cores directly.
引线自动剥皮后直接焊接在电容芯子上。
The lead, after being skinned, will be soldered on the cores directly.
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