小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
提供在电路板等上安装集成电路芯片的封装。
A package for mounting an integrated circuit chip to a circuit board or the like is provided.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
该镀层的可焊性优良，可作为印刷电路板和元器件的表面镀层，从而实现电子封装的无铅化。
The coating has excellent solder properties and can be used on the surfaces of printed circuit board and patch-like electronic apparatus in order to carry out lead-free electronic packing.
该软件可用于封装，电路板及系统级CFD模拟，包括自然对流、强制对流和辐射传热。
This software can be used for package -, board - or system-level CFD simulation, including natural and forced convection and radiation heat transfer.
单放大器提供SOT - 23封装，并在10引脚MSOP封装的应用电路板空间是至关重要的对偶。
Single amplifiers are available in SOT-23 packages and duals in a 10 Ld MSOP package for applications where board space is critical.
由于在印制电路板上的倒装芯片和CSP器件的紧凑设计，声音微图像己经成为检测这些封装的非常重要的一部分。
Because of the compact design of flip chips and CSP on PCB, acoustic micro imaging has become extremely important for inspecting these packages.
封装电路时，需要特别注意电路板的布局。
When packaging the circuit, pay special attention to the PC board's layout.
通孔作为垂直互联的主要实现方式在多层印制电路板和芯片封装中起着至关重要的作用。
As a vertical interconnect channel, through-hole plays an important role in multi-layer PCBs and IC packages.
基于Sigrity开发的电磁分析方面的专利技术，其软件工具提供快速和先进的可用于整块电路板和芯片封装的电源及信号完整性分析。
Based on proprietary and patented technologies, SIGRITY offers industry's unprecedented fast and advanced software tools capable for power and signal integrity analysis of entire PCBs and IC packages.
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
应用本实用新型，可以不必因为匹配另一种封装类型的集成电路而重新设计印刷电路板。
The advantage of applying the utility model is that people does not need to redesign an etched circuit card in order to match an integrated circuit of another packing type.
应用本实用新型，可以不必因为匹配另一种封装类型的集成电路而重新设计印刷电路板。
The advantage of applying the utility model is that people does not need to redesign an etched circuit card in order to match an integrated circuit of another packing type.
应用推荐