最后结合SEM下的台阶覆盖情况和接触孔电阻值，确定了通过对基准接触孔形貌进行物理轰击倒角的最优方法。
In conclusion, by step coverage under SEM and contact resistance, find the best method of physical bombing filleting on the baseline contact shape.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
探索了用地层倾角、长源距声波、电阻率、三孔隙度及蚀变系数识别储集空间类型以及对储层分类的方法；
The methods to identify the types of reservoir by using such parameters as dipmeter, long space sonic, resistivity, porosity and alteration factor are studied.
用该方法设计的线性化器具有一定的通用性，可以构成热电偶、热电阻温度计以及孔板流量计。
The linearization apparatus designed by this method is in common use. It can be used in thermocouple and resistance thermometers as well as flowmeters by means of orifice plates.
本文分别运用动态云纹-光弹性和电阻应变量测方法研究了相邻两炮孔之间爆炸应变场。
The blasting strain fields between two adjacent boreholes initiated simultaneously were investigated with the dynamic moire-photoelasticity and strain gauges.
本研究重点研究了MCM—C基板的可靠性，包括厚膜电阻，基板布线以及互连通孔。
This paper mainly studies the reliability of substrates of MCM-C including thick-film resistors, metal lines and vias for interconnection.
本文介绍了跨孔同步视电阻串测量工作方法。
The present paper introduces the working method of the transborehole synchronous apparent resistivity survey.
含氧化限制孔的VCSEL具有低的阈值电流，但氧化孔的存在也会加大串联电阻。
While AlAs oxide confined aperture may reduce the threshold current of vertical-cavity surface emitting lasers (VCSELs), it might also enlarge the series resistance of the VCSELs.
本实用新型涉及一种新型胶体蓄电池用低电阻隔板，特别是，涉及一种适用于胶体蓄电池的带有大孔的隔板。
The utility model relates to a novel low resistance spacer for a colloid accumulator, particularly the spacer with macro pores which is suitable for the colloid accumulator.
可以印刷透孔、通孔层、电阻温度系数较低的电阻、热敏电阻，5毫升容量。
Printing capabilities include thru hole, multi layer, low TCR resistors, thermistors, and 5 mil line and space capability. Substrates of up to 4 inch X 5 inch can be accommodated.
可以印刷透孔、通孔层、电阻温度系数较低的电阻、热敏电阻，5毫升容量。
Printing capabilities include thru hole, multi layer, low TCR resistors, thermistors, and 5 mil line and space capability. Substrates of up to 4 inch X 5 inch can be accommodated.
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