本文介绍了一种能提高干膜与线路板铜基粘合力的新型铜面处理剂ST-10+。
This paper introduced a new copper treatment agent ST-10+ for improving the adhesion of dry film to printed circuit board copper substrate.
基层处理干净后，将砂浆涂抹于基面，再用侧面带齿抹子将砂浆揉成条沟状后，即可粘贴饰面瓷砖，粘贴厚度为2 - 3 mm。
Clean substrate, apply the mortar on substrate, rub the mortar strip-shaped with a side-tooth trowel, and then can stick ceramic tiles. the thickness is about 2-3mm.
基层处理干净后，将砂浆涂抹于基面，再用侧面带齿抹子将砂浆揉成条沟状后，即可粘贴饰面瓷砖，粘贴厚度为2 - 3 mm。
Clean substrate, apply the mortar on substrate, rub the mortar strip-shaped with a side-tooth trowel, and then can stick ceramic tiles. the thickness is about 2-3mm.
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