• 硅片研磨过程中,由于应力积累剧烈机械作用,硅片表面损伤严重碎片增加

    In the process of wafer polishing, the wafer surface could be damaged badly and fragment rate will increase sharply, because of the accumulation of stress and the mechanical action.

    youdao

  • 研究了重晶石搅拌湿法超细研磨过程中产生机械力化学效应

    The mechanochemical effect of barite particles is studied during the wet ultrafine grinding by using stirred mill.

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  • 一些生产作业中,机械毛刺作业、研磨抛光机械自动装配作业机械接触控制相当关键的。

    In some applications of manufacture, for example robot burring, grinding, polishing, and robot auto assembly, the contacting force control between robot and its environments are critical.

    youdao

  • 研磨机床振动影响金刚石刀具机械研磨质量重要因素尤其精密研磨工序

    Vibration of lapping machine is an important influencing factor on the lapping quality of diamond cutting tools in mechanical lapping, especially in the precision lapping process.

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  • 超声研磨机械制造精密加工领域已有广泛应用。

    The ultrasonic lapping has already widely used in the precise machining of the other area.

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  • 深部井段地层硬度高研磨性强,钻头选型困难特别是高密度条件机械钻速

    The deep formation has a high degree of hardness and abrasivity; the bit type selection is difficult and the ROP is low especially under the high density mud.

    youdao

  • 深部井段地层硬度高研磨性强,钻头选型困难特别是高密度条件机械钻速

    The deep formation has a high degree of hardness and abrasivity; the bit type selection is difficult and the ROP is low especially under the high density mud.

    youdao

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