基于键合微平台技术，设计了一种电容式并联开关。
A capacitive shunt switch is designed on the basis of the micro-platform technology.
集合电路测试(ICT)是用于获取集成产品的电容，电阻，功率，开合，短路等状态值的实验。
ICT (Integrated circuit test) is a test during which we measure value of components, resistance, capacity, open, shorts tracks etc. on the assembled product.
从应用开发MEMS产品的实用角度出发，介绍了利用硅一硅键合技术制作的微型电容式压力传感器，给出了详细的制作工艺及主要工艺步骤图。
Introduced the capacitive pressure microsensor produced by Si-Si bonding technology in terms of the practicality of MEMS products. The producing technology and major diagrams were given in detail.
从应用开发MEMS产品的实用角度出发，介绍了利用硅一硅键合技术制作的微型电容式压力传感器，给出了详细的制作工艺及主要工艺步骤图。
Introduced the capacitive pressure microsensor produced by Si-Si bonding technology in terms of the practicality of MEMS products. The producing technology and major diagrams were given in detail.
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