因此，电沉积无铅可焊性镀层是电子电镀领域的研究热点之一。
Therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.
经小槽电镀，获得外观致密均匀，似镜面光亮，结合力强，具有优良的可焊性镀层。
A uniform, compact, bright lustre, good adhosive and excellent solderable coating was obtained by the experimental electroplating.
由于合金镀层具有的特殊性能及使用上的特殊要求，可分为耐磨性、可焊性、磁性及轴承合金等。
Because of the special alloy coatings has the properties and the application at the special requirements, can be divided into the wear resistance, solderability, magnetic and bearing alloy etc.
封闭后的雾面锡镀层仍有良好的可焊性。
The non-bright tin deposit has good solderability after sealing.
测定了锡镀层的孔隙率、可焊性和结合力。
Deposit properties such as porosity, solderability and adhesion were tested.
引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。
The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.
对锡-铅合金镀层的耐焊性和可焊性进行了检验以获得合格的MLCI产品。
Therefore, solderability of Sn Pb alloy deposit was tested for qualified MLCI products.
MLCI端头电极锡-铅合金电镀工艺及维护、镀后的清洗、MLCI的储存影响镀层的耐焊性和可焊性。
Solderability of Sn Pb alloy deposit is determined by electroplating process and its maintenance, post treatment rinsing, storage of MLCI, etc.
镀层具有良好的可焊性和导电性，其电极损耗低于银电极损耗，可作为代银接触镀层。
Ni B plating possesses good weldability and conductivity, and the electrode loss is lower than that of silver electrode. It may be used instead of silver plating.
结果表明，该添加剂工艺稳定性好，且镀层可焊性优良、抗变色能力强，可取代高污染的锡铅电镀工艺。
The result proves that the process has advantages of high stabilization, excellent solderability and antitarnishing, which may replace high-pollution tin-lead electroplating technology.
所得锡镀层光亮细致、结合力强、可焊性好、生产成本低、效率高。
Tin deposits obtained have strengths such as bright and uniform appearance, good coherence and weldability, Low cost and high efficiency.
试验获得外观良好镀层的电流密度范围，并对镀层的可焊性作了评估。
Experiments were made on a range of current densities, in order to obtain a coating with fine appearance. The solderability of coating is evaluated.
随着电子电镀工业的飞速发展，镀层质量的要求也越来越高，尤其是在可焊性方面更为突出。
With the rapid development of electronic electroplating industry, there are increasingly stringent requirements on the quality of the claddings, especially on the weldability.
该镀层的可焊性优良，可作为印刷电路板和元器件的表面镀层，从而实现电子封装的无铅化。
The coating has excellent solder properties and can be used on the surfaces of printed circuit board and patch-like electronic apparatus in order to carry out lead-free electronic packing.
该镀层的可焊性优良，可作为印刷电路板和元器件的表面镀层，从而实现电子封装的无铅化。
The coating has excellent solder properties and can be used on the surfaces of printed circuit board and patch-like electronic apparatus in order to carry out lead-free electronic packing.
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