介绍了半导体加工领域蓬勃发展的CMP技术。
The CMP technique used in the field of semi - conductor fabrication was introduced.
为了从中枢神经系统记录电信号，半导体加工技术已经被用于微电极探针的制造。
Semiconductor processing techniques are being utilized to fabricate multichannel microelectrode probes for recording neural signals from central nervous system.
虽然这些产品是为半导体加工应用而设计的，他们已被证明在其他行业也被很好的使用。
Although these products were designed for semiconductor processing applications, they have been proven useful in other industries.
微气压传感器广泛应用于化工、航天、食品加工、半导体加工、电子封装以及科学研究等领域。
Micro gas pressure sensors are widely used in the fields of chemical industry, spaceflight, foodstuff processing, semi-conductor processing, electronic encapsulation and scientific researches.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
这项技术主要告诉我们，像DNA这样的生物结构实际上能为我们在半导体加工工艺中的实际运用提供一些可再生的重复型方式。
Basically, this is telling us that biological structures like DNA actually offer some very reproducible, repetitive kinds of patterns that we can actually leverage in semiconductor processes.
其实归根结底，你还是需要去美国应用材料公司（Applied Materials）购置一套芯片加工设备，应用材料公司是半导体工业设备的主要供应商之一。
To do all this, you are probably going to need chip-manufacturing machines from Applied Materials, one of the main suppliers of such equipment to the semiconductor industry.
等离子体加工技术是在半导体制造中创立起来的一种新技术。
Plasma processing technology is a new technology developed in semiconductor manufacturing.
本发明提供一种半导体器件，对利用从背面进行的FIB加工等实施的不正当解析手段具有极高的抗篡改性。
The invention provided a semiconductor device which has a very high tamper resistance to improper analysis means due to FIB processing or the like from rear surface.
自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。
The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation.
本公司专门致力于豆腐乳，红糟，半导体耗材，机械五金加工。
We specialized in manufacturing pick bean curd, red vinasse, semiconductor consume materials, hardware processing for machinery, etc.
仓库、医院等洁净场所。实验室、仪器室、半导体、体积电路精密加工等无尘室。
Clean areas including the warehouses, hospitals. Etc. Dust-free rooms including the laboratories, apparatus rooms, semiconductor rooms, precisely interated circuit processing rooms, etc.
基于三种不同规模的半导体生产线模型，在非批加工设备使用不同的调度规则的情况下，对提出的SRB进行了仿真验证。
SRB was verified on three different scale semiconductor wafer fabrication facilities simulation models by applying various dispatching rules on non-batch processing machines.
本发明提供一种用于加工半导体工件的系统。
The present invention provides a system for use in processing semiconductor workpieces.
金刚石砂轮广泛用作硬质合金、工程陶瓷、光学玻璃、半导体材料、花岗岩等硬脆难加工材料的磨削工具。
Diamond grinding wheels are widely used as grinding tools in manufacturing of hard and brittle materials, such as hard alloy, engineering ceramics, optical glass, semiconductor materials, and granite.
粉尘电浆出现在一些工业加工过程中，如半导体制造，也出现在天体环境中，如土星B环。
They appear in industrial processing, such as semiconductor manufacturing, and also in planetary environments, such as in Saturn's B ring.
我公司产品广泛用于石材、陶瓷、刹车片、金属、半导体及其他材料的切磨加工等领域。
Our company widely applies in stone material, ceramics, brake lining, metal, semiconductor and other material domains and so on cut and polished processing.
半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。
Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.
有机电子材料作为一种新型电子材料，不但具备半导体的光学和电学特性，而且保留了有机物优良的加工处理和机械性能。
They are a novel class of electronic materials which combine the optical and electronic properties of semiconductors with the processing advantages and mechanical properties of polymers.
本文在分析了电火花加工半导体材料去除速率的基础上，通过掺硼对CVD金刚石厚膜进行半导体改性，继而实现了其电火花加工。
On the basis of analyzing the semiconducting material removal rate of EDM and making semiconductive modification for CVD diamond thick film by boron-doping, EDM of the thick diamond film was realized.
描述的是一个净化石英加工船用于外延在半导体生产和更特别是从气相方法。
Described is a method of purifying a quartz processing vessel used in the production of semiconductors and more particularly for epitaxy from the gaseous phase.
面泵浦固体激光器（即板条式激光器）、半导体二极管泵浦固体激光器和激光加工是这份报告的重点。
The report emphases on face-pumped solid-state lasers(or slab solid-state lasers), diode laser pumped solid-state lasers and laser material processing.
本文设计了一款测试芯片并在一家半导体厂加工制造。
A test chip is designed and manufactured in a semiconductor foundry to test the layout dependency of the electroplating process.
光掩膜是半导体和精密加工的必要成分。
A photomask is an essential component for semiconductor manufacturing and microfabrication.
微型机电系统技术是机械，传感器，电子，精密加工，半导体等技术的结合。
Micro-Electro-Mechanical-System is the integration of mechanical elements, sensors, actuators, and electronics micro-fabrication technology.
微型机电系统技术是机械，传感器，电子，精密加工，半导体等技术的结合。
Micro-Electro-Mechanical-System is the integration of mechanical elements, sensors, actuators, and electronics micro-fabrication technology.
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