最后提出了提高功率芯片可靠性的建议。
Finally, some Suggestions are put forward for improving the reliability of power chip.
小功率芯片集成封装，灯条之间可进行串联或并联，点亮后灯条之间无暗区。
Low power chip integrated package, light strip can be connected in series or parallel, no dark.
其中一个例子就是第六种元素T1功率芯片，这是安装在水里管的车的散热系统。
One example is the Sixth Element T1 Power Chip, which is fitted onto the water pipe of the car's radiator system.
对功率芯片VNH2SP30 - E的正常启动特性和故障诊断功能进行了研究与分析，给出了详细的汽车车窗防夹方案。
The normal starting characteristic and fault diagnosis function of the power chip VNH2SP30-E are studied and analyzed, and a detailed anti-pinch scheme for vehicle power window is proposed.
为了确保对电机和芯片的功率范围内保持一定水平。
To make sure the power limits of the motors and chips stay within certain level.
每个相关色温的芯片输出的实际流明；电通量和功率不同于CCT。
Real lumen output of chip for each correlated color temperature (CCT), flux and efficacy vary with (CCT).
本文介绍了CS5460 A芯片的特点、工作原理及其在高精度工频电压、电流、功率、功率因数、频率表中的应用。
The paper introduces the technique feature and the operation principle of chip CS5460A, and its application in high-accuracy power frequency voltage, current, power, power factor, frequency meter.
作为功率集成电路运用的一个重要分支，荧光灯镇流器芯片在其实现上充分体现了控制集成电路与功率器件在单一芯片上的有机结合。
Fluorescent lighting ballasts-to be one of the important branches of the applications of PIC- have symbolized the harmonic combination of the Controlled IC and Power IC within a single chip.
光碟机马达驱动芯片作为功率集成电路的一个重要分支，充分体现了控制集成电路与功率器件在单一芯片上的有机结合。
Motor Drive ICs, to be one of the important branches of the applications of SPIC, have symbolized the harmonic combination of the Controlled IC and Power IC within a single chip.
分析了LED芯片非接触检测系统噪声信号的功率谱，研究了噪声信号的抑制方法。
The noise power spectra of the non-contact detection system for LED chips and the noise suppression methods are discussed.
研究了激光功率，频率，扫描速度等参数及加工程序对芯片加工质量的影响。
The effects of laser power, frequency, writing speed and procedures on the quality of the chip was evaluated.
为提高光伏电池的光电转换效率，设计一种基于开路电压法的光伏电池最大功率点跟踪(MPPT)控制芯片。
An analog maximum power point tracking (MPPT) controller integrated circuit (IC) based on open-circuit voltage method was proposed to enhance the photovoltaic conversion efficiency of solar cell.
蓝牙技术是一种用于个人区域网络的低成本、低功率的无线通信技术，主要包括基带芯片和协议栈两个部分。
Bluetooth is a kind of low cost and low power wireless communication technology which is mainly applied in personal area net and consists of baseband chip and protocol stack.
介绍了以ad7757电能计量芯片为核心，设计一种测量市电有效功率的智能电度表的方法。
This article introduced take the AD7757 electrical energy measurement chip as the core, designs one kind of survey city electricity active power the intelligent electric meter method.
本文介绍了用单片机8031，8255等芯片和一些功率器件组成的自动控制系统。
This article present are automatic control system that consists of singlechip microcomputer 8031,8255 and power devices etc.
图片：最新的芯片和封装技术为中档功率等级。
Picture: Latest chip and package technology for the mid-range power class.
我们的DSP芯片设计允许有全输出功率下3%的低失真。
Our DSP chip design allows low distortion of 3% typical at full output power.
我们使用的大功率LED采用的都是美国高品质的普瑞芯片。
The high power LED we use adopts the high quality American BridgeLux chips.
对几千瓦以下的单相有源功率因数补偿控制芯片很多，其中UC3854最具代表性。
Single phase active power factor compensation control clips below thousands watts are very popular, among which UC3854 is most typical.
该SOI高压功率集成电路芯片的实现，为进一步实现实用化的SOI高压驱动电路提供了有力的实验验证。
The realization of the SOI HVIC chip offers sound experimental evidence to a further step of applying the SOI HVIC into practice.
应用有限元分析软件ANSYS，模拟功率载荷下叠层芯片封装中各层的温度和应力分布。
The finite element analysis (FET) software ANSYS have been used to simulate the temperature and stress distribution in stacked die package under power load.
基于常用的L6561芯片，设计了宽输入输出范围的400瓦金属卤化物灯电子镇流器功率因数校正电路。
Base on chip L6561, a PFC preregulator for 400w metal halide lamp ballast is designed with wide input and output range.
从芯片选择、改善热处理工艺以及如何选择硅胶等几个方面入手，本文讨论了如何有效地提高功率型LED封装工艺。
It is discusses the effect way to improve high power LED packaging technology, from dice selection, improve thermal management and how to select silicon Gel.
我们采用的控制芯片为TI公司的MSP430，无线传输模块采用的是通用的微功率无线数传模块，串口通讯方式。
We used ti Corporation's MSP430 as control chip, while took general wireless transceiver module with UART opened as communication means.
在3d -MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。
In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
由于存在高温度、大电流等问题，传统的测试与老化筛选功率管的方法不能完全适用于功率裸芯片。
The traditional methods for power transistor cant apply to power bare die due to various reasons such as high temperature and high operating currents.
所设计的无刷直流电机稳速控制系统用电机控制专用芯片ML4428实现了反电势的检测、换相和功率驱动；
Using the motor control special chip ML4428, the counter electromotive force detection and back-EMF commutation were realized.
在调制驱动电路中，采用MAX3263芯片，具备标准的PECL电平接口，可以灵活地调整激光器的预置电流和调制电流，并具备自动功率控制功能。
In modulation driving circuit, with the chip MAX3263, being the function of APC, there is standard PECL level interface to modulate laser modulation current and preset current neatly.
设备性能改善，消耗的功率降低，将更多器件集成到芯片内而提高可靠性，这种交易太划算了。
The performance of devices improves; the amount of power dissipated decreases; the reliability increases as we put more stuff on a single chip.
本文介绍了基于PWM芯片TL 494的大功率直流电机控制器的研究和开发。
This article introduced the research and the development of high power DC-MOTOR controller based on PWM with chip TL494.
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