喷雾冷却是一种高效的高热流密度散热方式。
Spray cooling is an efficient method for high heat flux removal.
微通道热沉是解决高热流密度微电子芯片散热的一种有效途径。
Microchannel heat sink is a promising technique to dissipate high heat flux microelectronic chips in the near future.
开发注塑模热流道辅助设计软件对提高热流道设计水平和效率具有重要意义。
So it is important to develop the design software of hot runner system in injection molding.
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