... integrated works 联合企业 integratedsemiconductor 集成半导体 integratiag factor 积分因子 ...
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制造集成电路需要将如半导体和金属等多层材料放置在硅片上。
Making integrated circuits involves depositing layers of materials such as semiconductors and metals on a silicon wafer.
为了处理上述挑战，IBM 的 System Technology Group (STG) 半导体制造部门基于集成的模块化体系结构创建了一套解决方案。
To address the above-described challenges, IBM's System Technology Group (STG) semiconductor manufacturing created solution based on an integrated modularized architecture.
Peak已经开发了半导体专利技术，使单一集成电路带宽扩音器代替高功率多路器组合扩音器成为可能。
Peak has developed proprietary semiconductor technology in which a single-ide bandwidth amplifier may replace multiple high-power multiplexer-combined-amplifiers.
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