为减小陶瓷板件切口宽度，提高切口质量，采用水箍和磁场对附加阳极等离子弧进行综合二次约束。
In order to reduce the kerf width and improve the kerf quality, the hydromagnetically confined plasma arc was used to cut engineering ceramic plates.
辅助阳极：除了在电镀中正常需用的阳极以外，为了改善被镀制件表面上的电流分布而使用的附加阳极。
Auxiliary anodes: in addition to the normal in electroplating need outside anode, and to improve the product plated on the surface of the current distribution and use additional anode.
采用适当的电镀技术诸如阳极化和附加阴极技术可以控制镀层的厚度和范围。
Proper use of special plating techniques, such as conforming anodes and robbers, can control plating thicknesses and runouts.
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