待镀工件与装夹密封装置一起组成了一个顶部开口的容器，在施镀过程中，工件为阴极，镀笔为阳极。

The workpiece to be plated and the clamping sealing device together form a container having an opening at the top; in plating process, the workpiece is the cathode, and the plating pen is the anode.

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它包括电解质膜、硅橡胶密封圈、多孔阳极板，及在所述电解质膜和多孔板之间的自由铺放的方式形成的催化剂颗粒层。

It includes electrolyte membrane, silicone rubber seal ring, multihole anode plate, and free lay mode formed granules of catalyst layer between said electrolyte membrane and multihole plate.

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