...固态电容、低电阻电晶体等第2代超耐久材质用料外，且进一步提升PCB用料，在12层PCB板中加入2盎司(oz)的铜膜 (Copper Inner layer)，令P45-U主机板温度及电阻性更低，讯号也更加干净，有效拉升主机板的稳定性及超频性能。
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所述的屏蔽层为一边带粘接剂的铜膜与换能器负极连接。
The shielding layer is a copper film provided with adhesives on one side, and is connected with the negative pole of the transducer.
采用定点激光反射热循环方法，测量了硅基体上铜膜应力随温度的变化及等温松弛。
The stress variation with temperature and isothermal relaxation in copper films deposited onto silicon wafers are studied by fixed point laser reflection method.
通过对化学镀铜膜形貌和结晶方面的研究发现：籽晶层对铜膜最终形貌和择优取向有较大的影响。
Through the study, we find that the morphology and crystallography of the seed layer has an important effect on the as-deposited Cu films.
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