影响铜粉导电胶导电性能和自然老化性能的主要因素是胶的配方和工艺条件，铜粉粒度。
Main factors which affect conductivity and natural aging resistance are formula. Technology and Cu powder size.
以环氧树脂为基体，间苯二胺和二氨基二苯甲烷的低融点混合物为固化剂，铜粉为导电填料，制备了热固化各向同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以改性树脂和混合树脂为粘料，铜粉为导电性填料，并配以适当添加剂、固化剂制备铜导电胶。
Copper conductive adhesive is prepared by using modified resins and mixed resins as cohesive materials and Copper powders as conductive fillers.
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