在电子电器领域，产品制造过程零配件之间连接导通工艺中的铅锡焊料所引起的环境污染越来越引起人们的重视。

In the electrical and electronic fields, Pb-Sn solder which is used to connect parts in the product manufacturing process can cause environmental pollution, which has drawn increasing attention.

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方法准确、可靠、简便、快速，完全适用于银锡焊料中微量铅的检验。

The method is proved to be accurate, reliable, convenient and quick, absolutely suitable for the assaying of trace lead in silver tin solder.

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仪表适用于测量氨的液体和气体的压力真空，也可测量对碳钢、奥氏体不锈钢和锡铅类焊料无腐蚀作用的介质的压力和真空。

It is used for pressure and vacuum of ammoniac liquid and gas as well as of zhe madia which can't corrode carbon steel, stainless steel and solders like tin and lead.

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