铜对Zn-Al基软钎料性能的影响 - 中南大学学报（自然科学版、英文版） 关键字: 钎料; Zn-Al-Cu;钎焊性能;热交换器[gap=1174]Key words: solder; Zn-Al-Cu; solderability; heat exchanger
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Thus, looking for proper brazing filler alloy and soldering flux and improving cutting tools' brazing performance become an urgent affair in the development of PCD cutting tools.
寻找合适的钎料、钎剂搭配，提高刀具的钎焊性能成为PCD刀具发展的当务之急。
参考来源 - 聚晶金刚石复合片高频感应钎焊试验研究·2,447,543篇论文数据，部分数据来源于NoteExpress
离子注入确实可以显著提高陶瓷材料的可焊性，但提高陶瓷材料表面导电性并不是提高其钎焊性能的主要因素。
Ion implantation can surely improve the joining ability of the ceramic surface, but the reasons of improving the brazing ability other than the electric conductivity should be found.
钎料的钎焊性能很大程度取决于钎料对基板上的润湿性能，而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。
The solderability of electronic solders depends to a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates.
钎料的钎焊性能很大程度上取决于钎料对基板的润湿性能，而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。
The solderability depends on a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates.
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